positiveSYS.SOURCE: OKI• 2026-10-01T14:00:54Z
OKI Develops 124-Layer PCB Technology for AI Semiconductor Testing Equipment
OKI has developed 124-layer PCB technology for wafer inspection equipment targeting next-generation high bandwidth memory (HBM) used in AI semiconductors. This advancement enables higher data transfer speeds and density, addressing the demands of advanced AI processing.
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