importantSYS.SOURCE: Thelec.net• 2026-09-07T04:27:29Z
Samsung Unveils zHBM 3D Memory Technology for AI Accelerators
Samsung introduced zHBM, a 3D memory architecture stacking HBM on AI accelerators to boost performance by eight times and improve power efficiency. The company also unveiled zNAND-O and 400-layer V10 BV-NAND, enhancing storage density and real-time data processing for AI workloads.
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